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Three Redmi K50 models are ready to go: they received the latest SoC Dimensity 8000, as well as Dimensity 9000 and Snapdragon 870

Three phones of the Redmi K50 series have been approved for release in China, having passed the certification of the local regulator TENAA. These devices have model numbers 22021211RC, 22041211AC, and 22011211C.

A well-known Chinese insider under the nickname Digital Chat Station reported that these phones received MediaTek Dimensity 9000 single-chip systems, Qualcomm Snapdragon 870 and the yet unannounced MediaTek Dimensity 8000 platform.

According to previous reports, the Redmi K50 series smartphone with model number 22021211RC will be equipped with a single-chip Snapdragon 870 system. In addition, it was previously reported that model number 22041211AC is based on Dimensity 7000, which was renamed Dimensity 8000 during development.

There was also information that the smartphone with the number 22011211C is built on Qualcomm Snapdragon 8 Gen 1, but now it is expected that this device can receive MediaTek Dimensity 9000, and not Qualcomm's flagship solution.

Earlier it was reported that Redmi K50 Gaming Edition will be presented in February, this smartphone will receive a FullHD + screen, and the flagship with a 2K screen will debut later. Redmi K50 Gaming Edition will be built on the Snapdragon 8 Gen 1 single-chip system, it will receive a 4700 mAh battery with support for 120 W fast charging, a 64-megapixel main and 16-megapixel front camera, as well as a side fingerprint scanner.

This insider was the first to reveal the specifications of Redmi K30, K40, Xiaomi Mi 10 and Mi 11.

Three Redmi K50 models are ready to go: they received the latest SoC Dimensity 8000, as well as Dimensity 9000 and Snapdragon 870