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SK Hynix wants to build a chip testing and packaging plant in the US

Early next year, South Korean company SK Hynix intends to start building a chip packaging and testing facility in the United States. It should reach its design capacity in 2025-2026, Reuters reports, citing a source in the company.

The cost of the plant will reach several billion dollars, it will be able to provide jobs for about 1,000 people. The company "hopes to select a site and begin construction in the first quarter of next year." According to sources, they will try to build a plant near a technical educational institution in order to provide personnel.

SK Hynix owner, the SK Group conglomerate, announced plans to build a new plant last month. The venture will be part of a $22 billion investment SK Group will make into semiconductors and clean energy projects.

SK Group also hopes that its enterprise will receive subsidies from the US government. This week, US President Joe Biden signed into law the Chip Act, which provides subsidies for manufacturing and research in the field of microchips. The country's budget includes $52 billion in subsidies. SK Hynix sources say the company will bid to subsidize the construction of the plant, as well as R&D programs in the semiconductor industry.

SK Hynix wants to build a chip testing and packaging plant in the US