Researchers from the Georgia Institute of Technology (USA) have developed special sand from silicon dioxide nanoparticles coated with a polymer with high dielectric constant. New development will be able to provide a high degree of cooling more and more energy-intensive electronic devices.
Silicon dioxide itself does not have cooling abilities. It is the unique surface properties of nanoscale material allow you to carry out heat with potentially higher efficiency than other existing heat sink materials. In the process of heat sink, electromagnetic effects are involved on the surface of the smallest particles of silica, which ultimately allowed scientists to talk about the appearance of a potentially new class of materials with high thermal conductivity.
Silicon dioxide nanoparticles were coated with ethylene glycol - extension widely used In the production of antifreeze. As a result of the heat transfer, the nanoparticles rose 20 times to 1 watt per meter on Kelvin, which is higher than with the use of ethylene or silica.
Thus, an electronic device protected by nanoparticles covered with ethylene glycol, never will overheat, "says Baratunde Cola, Professor of the Georgia Institute of Technology.
bbabo.Net